WLE7000E5 is a high-performance single-band 5GHz WiFi 7 (802.11be) wireless module based on Qualcomm QCN6224/QCN9274, featuring 4T4R MU-MIMO for exceptional throughput up to 8.647Gbps in enterprise and industrial applications.
Target Users:Enterprise network integrators, industrial IoT solution providers, network security appliance manufacturers, transportation system developers, SMB networking equipment vendors.
Core Strengths:WiFi 7 (802.11be) with 4096-QAM, OFDMA, Multi-Link Operation (MLO), and preamble puncturing support. 4×4 MU-MIMO architecture for extended signal coverage and multi-user capacity.
Typical Applications:Enterprise APs, Industrial IoT gateways, Wireless bridges, Test & development platforms, SMB networking equipment.
The WLE7000E5 module features 5GHz single-band WiFi 7 connectivity with 4×4 MU-MIMO for high-performance wireless applications.
| Parameter | Specification |
|---|---|
| Chipset | Qualcomm QCN6224 (Commercial) / QCN9274 (Industrial) |
| WiFi Standard | IEEE 802.11a/n/ax/be |
| MIMO Configuration | 4×4 MU-MIMO (4T4R) |
| Frequency Bands | 5GHz: 5.15~5.825GHz |
| Channel Widths | 20/40/80/160/240MHz |
| Max Throughput | 8.647Gbps (8647Mbps) |
| Transmit Power | Up to 18dBm per chain (Typical) |
| Interface | PCIe 3.0 x1 |
| Form Factor | Mini PCIe 3.0 |
| Antenna Connectors | 4x U.FL Connectors |
| DC Input Voltage | 3.3V DC |
| Maximum Power Consumption | 8.5W (Max) |
| Operating Temperature | QCN6224: 0°C to +70°C / QCN9274: -40°C to +85°C |
| Certifications | FCC, CE RED, IC, REACH, RoHS |
| Label | Component | Function Description |
|---|---|---|
| U.FL Connectors (CH0-CH3) | 4-channel antenna ports | 4T4R (4 Transmit 4 Receive) architecture, supporting 4×4 MU-MIMO operation for WiFi 7. Independent RF chains support beamforming and MIMO, compatible with high-gain antenna deployments. |
| Mini PCI Express 3.0 Standard | Edge connector | Compatible with standard Mini PCIe slots, supporting PCIe 3.0 x1 high-speed data bus for host communication and control. |
| Heatsink | Passive thermal solution | Provides cooling for RF chips under high-load conditions, preventing thermal throttling and ensuring continuous industrial-grade stability. |
| Pin Group | Key Signals | Function Description |
|---|---|---|
| Power Pins | 2/24/52: VDD_3V3 | Main 3.3V DC power input; single-rail supply, no additional 5V/12V required. |
| Reference Clock | 11/13: REFCLK-/REFCLK+ | 100MHz differential reference clock for PCIe synchronization between the module and host. |
| PCIe Data Lane | 23/25: PCIE0_RX0_N/P 31/33: PCIE0_TX0_N/P |
PCIe 3.0 x1 high-speed differential transmit/receive pairs, supporting up to 8Gbps throughput for WiFi 7. |
| Control & Status | 1: WAKE_3v3 20: W_DISABLE_1V8 22: PERST_3v3 |
Host wake-up, RF disable, and hardware reset signals for power management and module control. |
| Ground Pins | 9/15/18/21/26/27/29/34/35/40/43/50: GND | Full-path grounding to minimize electromagnetic interference and ensure RF signal integrity. |
| NC (No Connect) | Reserved pins | No electrical function, ensuring backward compatibility with legacy Mini PCIe slots. |
Compliant with the EHT (Extremely High Throughput) standard, supporting 240MHz ultra-wide channels, Multi-Link Operation (MLO), MU-MIMO, and OFDMA. Delivers theoretical throughput exceeding 8Gbps, significantly improving concurrency and data rates in high-density environments.
Four independent RF chains support spatial multiplexing and beamforming, enabling enhanced signal coverage and long-range transmission stability for demanding enterprise applications.
Wide operating temperature range (-40°C to +85°C), passive cooling, and high-anti-interference RF design, suitable for harsh environments such as outdoor bridges, industrial gateways, and vehicle-mounted devices.
Compatible with most industrial motherboards and enterprise-grade equipment, supporting quick replacement and upgrades without additional hardware modifications.
Enables simultaneous transmission across multiple frequency bands, reducing latency and aggregating throughput for improved network performance.
Supports simultaneous AP and STA modes for wireless backhaul while providing client access in a single device.
| Model | Description |
|---|---|
| WLE7000E5 (QCN6224) | Commercial-grade 5GHz WiFi 7 module, 4×4 MU-MIMO, Mini PCIe 3.0, operating temp: 0°C to +70°C |
| WLE7000E5 (QCN9274) | Industrial-grade variant with extended temperature range (-40°C to +85°C) and FIPS L2 security certification |
| Parameter | WLE7000E5 (5GHz) | WLTE7000E2 (2.4GHz) | WLTE7002E26 (2.4+6GHz) |
|---|---|---|---|
| Frequency Bands | 5GHz Single | 2.4GHz Single | 2.4GHz + 6GHz |
| Chipset | QCN6224/QCN9274 | QCN6274/QCN9274 | QCN6274/QCN6274/QCN9274 |
| MIMO Configuration | 4×4 MU-MIMO | 4×4 MU-MIMO | 2×2 MU-MIMO |
| Max Throughput | 8.647Gbps | 1.376Gbps | ~7.5Gbps |
| Interface | Mini PCIe 3.0 | M.2 E Key | M.2 2230 E Key |
| Model | Description | Temperature | Ordering Code |
|---|---|---|---|
| WLE7000E5 | 5GHz WiFi 7 Module, QCN6224, 4×4 MU-MIMO, Mini PCIe 3.0 | 0°C to +70°C | WLE7000E5-XX |
| WLE7000E5-I | 5GHz WiFi 7 Module, QCN9274, 4×4 MU-MIMO, Mini PCIe 3.0, FIPS L2 | -40°C to +85°C | WLE7000E5-I-XX |
WLE7000E5 is a 5GHz single-band WiFi 7 (802.11be) wireless module based on Qualcomm QCN6224/QCN9274, using 4T4R MU-MIMO and Mini PCIe 3.0 form factor for industrial & enterprise applications.
Commercial Grade: Qualcomm QCN6224
Industrial Grade: Qualcomm QCN9274 (supports FIPS L2 security encryption)
It supports 5GHz single-band only, frequency range: 5.15~5.825GHz.
4×4 MU-MIMO, 5GHz band up to 8647Mbps (8.647Gbps).
Up to 18dBm per chain in 5GHz band.
Standard Mini PCIe 3.0 form factor, PCIe 3.0 x1 high-speed host interface.
4× U.FL antenna connectors, supporting 4T4R architecture.
Operating voltage: DC 3.3V
Max power consumption: 8.5W (full-load 4T4R transmit mode).
Yes, it supports simultaneous AP and STA modes for wireless backhaul and client access.
Supports 4096-QAM, OFDMA, Multi-Link Operation (MLO), Preamble Puncturing, 240MHz channel width.
Yes, compatible with Intel x86, NXP, Marvell ARM processors beyond Qualcomm ecosystem.
FCC, CE RED, IC, RoHS, REACH certified.