Wi-Fi 5 (802.11ac Wave 2)
Industrial-Grade Wi-Fi 5 (802.11ac Wave 2) MiniPCIe Modules
Welcome to yuneng Micro premium selection of industrial-grade Wi-Fi 5 (802.11ac Wave 2) wireless communication modules. Designed explicitly for high-density, long-range, and mission-critical industrial networking, our hardware delivers enterprise-level stability and high-throughput connectivity in challenging RF environments.
High-Performance Qualcomm Chipsets & 4×4 MU-MIMO Technology
Our Wi-Fi 5 Wave 2 portfolio is built upon robust Qualcomm Atheros QCA9984 and QCA9994 silicon architectures. Featuring advanced 4×4 MU-MIMO (Multi-User, Multiple-Input, Multiple-Output) and Wave 2 technology, these modules achieve wireless data rates up to 1733Mbps. They allow access points to transmit data to multiple client devices simultaneously, significantly expanding network capacity and reducing latency for bandwidth-heavy industrial applications.
High Power & Extended Range for Industrial PCBA Integration
As a professional original manufacturer specializing in wireless communication PCBA mainboards, yuneng Micro integrates high-power RF front-ends into standard MiniPCIe form factors. With Tx power options reaching up to 26dBm and 27dBm, these modules ensure reliable wall-penetration and long-distance transmission. Available in dual-band (2.4/5GHz) and dedicated single-band (2.4GHz or 5GHz) configurations, our modules offer precise spectral optimization for specialized deployment:
- Dual-Band Series (WLE1216VX / WLE1216VX-I): Versatile 2.4/5GHz concurrent operation for balanced coverage and throughput.
- 5GHz Single-Band Series (WLE1216V5-20 / WLE1216V5-20-I): Clean, interference-free spectral efficiency for high-speed wireless backhaul.
- 2.4GHz Single-Band Series (WLE1216V2-20 / WLE1216V2-20-I): Maximum distance propagation and high-power signal penetration.
Engineered for Rugged, Mission-Critical Deployments
yuneng Micro Wi-Fi 5 Wave 2 MiniPCIe modules are ruggedized with industrial-grade components (including "-I" temperature-extended models) to withstand extreme operational temperatures. They serve as the ideal core communication components for high-capacity wireless AP mainboards, wireless bridges, tactical mobile MESH networking hardware, and smart industrial surveillance gateways.
