WiFi 7 (802.11be) 4×4 MU-MIMO 2.4GHz Single Band Module QCN6224/QCN9274 WLE7000E2
- Qualcomm QCN6224 ‘Waikiki’ series for Commercial Grade
- Qualcomm QCN9274 ‘Waikiki’ series for Industrial Grade
- MiniPCIe Interface with PCIe 3.0
- Based on WK02.2 reference design
- Supports up to 4096-QAM
- -20°C to 70°C operating temperature
WiFi 7 (802.11be) 4×4 MU-MIMO 2.4GHz Single Band Module – WLE7000E2
Product Overview
WLE7000E2 is a high-performance single-band 2.4GHz WiFi 7 (802.11be) wireless module based on Qualcomm QCN6224/QCN9274, featuring 4×4 MU-MIMO for exceptional throughput and coverage in enterprise and industrial applications.
Key Overview
Target Users：Enterprise network integrators, industrial IoT solution providers, network security appliance manufacturers, transportation system developers, SMB networking equipment vendors.
Core Strengths：WiFi 7 (802.11be) with 4096-QAM, OFDMA, Multi-Link Operation (MLO), and preamble puncturing support. 4×4 MU-MIMO for extended signal coverage and multi-user capacity.
Typical Applications：Enterprise APs, Industrial IoT gateways, Wireless bridges, Test & development platforms, SMB networking equipment.
Technical Specifications
The WLE7000E2 module features 2.4GHz single-band WiFi 7 connectivity with 4×4 MU-MIMO for high-performance wireless applications.
| Parameter | Specification |
|---|---|
| Chipset | Qualcomm QCN6224 (Commercial) / QCN9274 (Industrial) |
| WiFi Standard | IEEE 802.11b/g/n/ax/be |
| MIMO Configuration | 4×4 MU-MIMO (4T4R) |
| Frequency Bands | 2.4GHz: 2.412~2.472GHz |
| Channel Widths | 20/40MHz |
| Max Throughput | 1.376Gbps (1376Mbps) |
| Transmit Power | Up to 20dBm per chain (Typical) |
| Interface | PCIe 3.0 x1 |
| Form Factor | Mini PCIe |
| Antenna Connectors | 4x U.FL Connectors |
| DC Input Voltage | 3.3V DC |
| Maximum Power Consumption | 8W (Max) |
| Operating Temperature | QCN6224: 0°C to +70°C / QCN9274: -40°C to +85°C |
| Certifications | FCC, CE RED, IC, REACH, RoHS |
Component Layout
- U.FL Connectors (CH0-CH3): 4-channel antenna ports supporting 4T4R architecture, delivering up to 20dBm transmit power per channel with beamforming support.
- Mini PCI Express 3.0 Slot: Standardized host interface with PCIe 3.0 x1 high-speed data bus (8Gbps theoretical bandwidth).
- Passive Heatsink: Integrated thermal solution for stable operation under high-load conditions.
MiniPCIe Slot Pin Assignment
| Pin Group | Key Signals | Function Description |
|---|---|---|
| Power Pins | 2 / 24 / 52: VDD_3V3 | Main 3.3V DC power input for module operation. |
| Reference Clock | 11 / 13: REFCLK- / REFCLK+ | 100MHz differential reference clock for PCIe synchronization. |
| PCIe Data Lane | 23/25: PCIE0_RX0_N/P 31/33: PCIE0_TX0_N/P |
PCIe 3.0 x1 high-speed differential transmit/receive channels. |
| Control & Status | 1: WAKE_3v3 20: W_DISABLE_1V8 22: PERST_3v3 |
Host wake-up, RF disable, and hardware reset signals. |
| Ground Pins | 9, 15, 18, 21, 26, 27, 29, 34, 35, 40, 43, 50: GND | Multiple ground terminals ensuring signal integrity. |
| NC Pins | No Connect | Reserved pins for backward compatibility. |
Key Features
WiFi 7 (802.11be) Support
Implements EHT standard with 4096-QAM, OFDMA, Multi-Link Operation (MLO), and Preamble Puncturing for ultra-low latency and improved spectral efficiency.
4T4R MIMO Architecture
Four independent RF chains enhance signal coverage, transmission distance, and multi-user throughput performance for demanding enterprise environments.
Industrial-Grade Reliability
Wide temperature range (-40°C to +85°C), passive cooling, and ruggedized design for outdoor, vehicle-mounted, and factory automation environments.
Standard Mini PCIe Form Factor
Fully compatible with industrial motherboards, wireless APs, and embedded systems for easy integration and upgrade.
AP + STA Concurrent Mode
Supports simultaneous AP and STA modes, enabling backhaul connectivity while providing client access in a single device.
Cross-Platform Compatibility
Compatible with Intel x86, NXP, and Marvell ARM processors beyond Qualcomm ecosystem.
Model Variants
| Model | Description |
|---|---|
| WLE7000E2 (QCN6224) | Commercial-grade 2.4GHz WiFi 7 module, 4×4 MU-MIMO, Mini PCIe 3.0, operating temp: 0°C to +70°C |
| WLE7000E2 (QCN9274) | Industrial-grade variant with extended temperature range (-40°C to +85°C) and FIPS L2 security certification |
Target Applications
- Enterprise Wireless APs & Routers: Core RF module for high-density WiFi 7 coverage in offices, hotels, campuses, and shopping malls.
- Wireless Bridges & Backhaul: Long-distance point-to-point/point-to-multipoint wireless transmission for surveillance and IoT networks.
- Industrial & Embedded Devices: IPCs, edge gateways, vehicle-mounted terminals with WiFi 7 connectivity for industrial automation.
- Test & Development Platforms: R&D laboratories for WiFi 7 protocol testing and performance validation.
Comparison Table
| Parameter | WLE7000E2 (2.4GHz) | WLTE7002E26 (2.4+6GHz) | WLTE7002E56 (5+6GHz) |
|---|---|---|---|
| Frequency Bands | 2.4GHz Single | 2.4GHz + 6GHz | 5GHz + 6GHz |
| Chipset | QCN6224/QCN9274 | QCN6224/QCN6274/QCN9274 | QCN6274/QCN9274 |
| MIMO Configuration | 4×4 MU-MIMO | 2×2 MU-MIMO | 2×2 MU-MIMO |
| Max Throughput | 1.376Gbps | ~7.5Gbps | ~10Gbps |
| Interface | Mini PCIe 3.0 | M.2 2230 E Key | M.2 2230 E Key |
Ordering Information
| Model | Description | Temperature | Ordering Code |
|---|---|---|---|
| WLE7000E2 | 2.4GHz WiFi 7 Module, QCN6224, 4×4 MU-MIMO, Mini PCIe | 0°C to +70°C | WLE7000E2-XX |
| WLE7000E2-I | 2.4GHz WiFi 7 Module, QCN9274, 4×4 MU-MIMO, Mini PCIe, FIPS L2 | -40°C to +85°C | WLE7000E2-I-XX |
Frequently Asked Questions
What is WLE7000E2?
WLE7000E2 is a 2.4GHz single-band WiFi 7 (802.11be) module based on Qualcomm QCN6224/QCN9274, using 4T4R MU-MIMO architecture, Mini PCIe 3.0 form factor for industrial & enterprise use.
What chipsets are available for WLE7000E2?
Commercial Grade: Qualcomm QCN6224
Industrial Grade: Qualcomm QCN9274 (supports FIPS L2 security encryption)
What frequency band does WLE7000E2 support?
It supports 2.4GHz single-band only, frequency range: 2.412~2.472GHz.
What is the maximum throughput of WLE7000E2?
4×4 MU-MIMO, 2.4GHz band up to 1376Mbps (1.376Gbps).
What is the transmit power per chain?
Up to 20dBm per chain in 2.4GHz band.
What interface and form factor does it use?
Standard Mini PCIe 3.0 form factor, PCIe 3.0 x1 high-speed host interface.
How many antenna connectors does it have?
4× U.FL antenna connectors, supporting 4T4R architecture.
What is the power supply and power consumption?
Operating voltage: DC 3.3V
Max power consumption: 8W (full-load 4T4R transmit mode).
Does it support AP + STA concurrent mode?
Yes, it supports simultaneous AP and STA modes for wireless backhaul and client access.
What WiFi 7 features are supported?
Supports 4096-QAM, OFDMA, Multi-Link Operation (MLO), Preamble Puncturing.
Is this module compatible with x86/ARM platforms?
Yes, compatible with Intel x86, NXP, Marvell ARM processors beyond Qualcomm ecosystem.
What certifications & compliances does it have?
Meets FCC, CE RED, IC, RoHS, REACH standards.
